In semiconductor fabs, cleanliness isn’t just important—it’s everything.
Microscopic contamination can mean millions in losses. That’s why leading fabs turn to ISTE’s FOUP & FOSB Cleaner, a purpose-built solution for deep-cleaning 300mm wafer carriers.
Our system separates and individually cleans FOUP and FOSB lids and bodies, ensuring complete removal of particles, residues, and water marks—all within a compact footprint designed for modern cleanrooms.
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Key features include:
✔ Full-coverage washing & drying
✔ ≤200 particles (0.1 µm) after cleaning
✔ Integrated N₂ purge and leak check at the load port
✔ Ultra-low humidity: ≤5%
✔ Throughput: 20 FOUPs/hour
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When every nanometer matters, trust a system built for yield, precision, and performance.
Clean smarter. Clean deeper. Clean ISTE.
